Daitron (M) Sdn.Bhd
http://www.daitron.com.my
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Our line-up of processing, cleaning and inspection system designed to meet the high precision requirement for silicon wafer manufacturing. |
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INGOT CYLINDRICAL GRINDER |
INGOT CROPPING SAW (ID SAW) |
DOUBLE SIDE GRINDER |
HIGH PRECISION EDGE GRINDER HPG-300A | |
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EDGE GRINDER DEP-150 |
DOUBLE SIDE LAPPER USP-32B |
EDGE POLISHER SCP-200 |
SINGLE SIDE POLISHER (BATCH) SPM-23 | |
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DOUBLE SIDE POLISHER (BATCH) LPD-300 |
ISINGLE SIDE POLISHER (SINGLE WAFER) MCP-302 |
FLATNESS TESTER NANOMETRO 300TT |
VISUAL SURFACE INSPECTION SYSTEM | | |
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